2021 6th International Symposium on Mechatronics and Civil Engineering

Meeting Time

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会议时间

February 26,2021 February 28,2021

Countdown

Index

EI Compendex、Scopus

Due time for submission

2021.02.22

Contact

Wechat:
Phone:
+86-13422186485
QQ:
3577263889
E-mail:
ICAMMCE@163.com

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Welcome to ISMCE 2021

With the experience of running successful events over the past 5 years, we are confident that 2021 will witness an even greater success of the 6th ISMCE.


The 2021 6th International Symposium on Mechatronics and Civil Engineering (ISMCE 2021) will be held on February 26-28, 2021 in Xiamen, China. ISMCE 2021 is Organized by AEIC Academic Exchange Information Center. ISMCE 2021 is to bring together innovative academics and industrial experts in the field of mechatronics and civil engineering to a common forum. The primary goal of the conference is to promote research and developmental activities in mechatronics and civil engineering and another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. The conference will be held every year to make it an ideal platform for people to share views and experiences in mechatronics and civil engineering and related.

Host

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Academic Exchange Information Center, also known as AEIC, is a well-developed platform for academic exchanges founded jointly by universities, research institutes and enterprises worldwide. Supported by professionals and researchers from across the globe, AEIC strives to promote sharing of academic information, boost research cooperation, explore hot social topics and encourage science popularization initiatives. Dedicated to “providing professional and devoting service” and built on the core values of “professionalism, devotion and dedication”, AEIC seeks to provide more opportunities of academic exchange. We provide publication services for authors from academic conferences indexed by EI/CPCI so that their manuscripts can be widely cited. We also recommend quality research manuscripts for publication on SCI and SSCI journals.